The applicable scenarios cover FPC, IPX, IPEX, HSC and other series connectors, as well as metal shrapnel such as SMD and semiconductor chip packages such as SOP/TOSP. With its transparent visibility and double-sided 10⁵-10⁹ Ω/cm² low SR, it is suitable for various packaging scenarios with comprehensive requirements for surface resistivity and observability.
For small metal components (e.g., beryllium copper), various passive components, and electronics suc...
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