Suitable for FPC, IPX, IPEX, HSC connectors and SMD metal shrapnel packages. Its combination of transparency, low SR of 10⁵-10⁹ Ω/cm² on the adhesive side, and high SR of 10¹² Ω/cm² on the film side makes it suitable for packaging applications with differentiated requirements for observability and surface resistivity.
For small metal components (e.g., beryllium copper), various passive components, and electronics suc...
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