With its transparent appearance, wide in width specifications, and high double-sided surface resistivity(SR), it is suitable for SIC, MOS, PNP and other series of diodes and tertiary transistors, as well as SOP series integrated circuit (IC) packaging, providing a stable packaging environment for devices and helping to ensure product performance.
For small metal components (e.g., beryllium copper), various passive components, and electronics suc...
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